industrial hardware
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Freescale takes display-centric, real-time embedded processing to new levels
Expanded i.MX 6 architecture combines high performance processing, exceptional responsiveness and maximum power efficiency with ARM(r) Cortex(r)-A9 and Cortex-M4 technology
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Reliable, Removable, Rugged Storage for Embedded Systems
Greenliant Now Shipping mSATA ArmourDrive(tm) SSDs with Built-In Power Interrupt Data Protection
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Industrial Automation Equipment to See Stronger Growth in 2014 after Two Mediocre Years
Industrial automation equipment (IAE) is poised for stronger growth in 2014, aided by strengthening economies as well as technological innovations that will boost demand, according to a new report from IHS Technology.
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Virtium Announces DDR4 Embedded Infrastructure Market Support and Initial DDR4 VLP RDIMM Products
One of the First to Offer DDR4 Memory Modules, Virtium Customers Get Early Access to Lower Power, Higher Bandwidth and Density Benefits of Latest DRAM Technology
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Disconnect Between Equipment Purchasers and Factory Operators Costs Manufacturers Billions
A lack of communication results in massive energy-inefficiency costs for manufacturers during the lifetimes of their production facilities
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Crystal Group Teams with University of Iowa's Operator Performance Laboratory for Real World Product Evaluation
OPL performs research on a diverse array of platforms, including fixed and rotary-wing aircraft, instrumented vehicles, and ground transportation.
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Motor Driver from Microchip is Automotive AEC-Q100 Qualified, Highly Integrated and Compact; Provides High Performance and High Current
Cost-Effective MCP8063 is World's First 1.5 Ampere, Three-Phase Brushless DC, Sinusoidal Motor Driver in a 4x4 mm Package With the AEC-Q100 Quality Certification
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Ontario Ice Rink Project Benefits from Wireless Load Monitoring
The BroadWeigh(tm) wireless load monitoring system chosen to ensure structural safety when installing over-head multi-screen
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Rise of the Machines: Industrial Machinery Market Growth to Double in 2014
As economic conditions continue to improve worldwide, the demand for machines in sectors such as agriculture, packaging, materials handling and machine tools will push revenues to $1.6 trillion this year, up from $1.5 trillion in 2013.
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Newark element14 Extends Freescale Freedom Kinetis E Development Kit Series
Low cost MCUs offer 32-bit processing for electrically harsh environments
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Cermetek Module Combines Wifi And Ethernet Functions
CH232BGN supplies 802.11b/g/n WiFi and 100 Base-T Ethernet for Embedded Systems.
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Industry Veteran Fergus Clarke Joins Picodeon as CEO
APPOINTMENT COMES AS PICODEON PREPARES FOR GROWTH
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Molex Debuts Weld-Slag and Oil-Resistant Cable for Industrial Machines and Automated Production Lines
Rugged and versatile WSOR cable improves operational efficiencies in harsh environments
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Thermo Bond Buildings acquires Precast Concrete assets of Mobile/Modular Express II, LLC
Thermo Bond Buildings, LLC, a leading provider of Custom Lightweight Equipment Enclosures for the Telecom, Government, Fiber and Power Generation Industries, today announced that they have acquired the Precast Concrete Assets of Mobile/Modular Express II.
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3D Systems Brings 3DPRINTING 2.0 to the Additive Manufacturing User Group
MUG attendees will have the opportunity to experience 3DPRINTING 2.0--defined by exponential 3D printing speed, size and capacity along with advanced performance materials and scan-to-design and inspection tools --and what it means to the industrial user.
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Nallatech Delivers OpenCL Integrated Platforms for FPGA Accelerated Computing
Platforms Bundled with Server, FPGA Accelerator Card, OpenCL Software Development Kit, and Tools Enable Rapid Production Ramp-Up
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Tastier Than Four Raspberry PIs: Post-it Sized, Lego-like 3D Expandable Freescale i.MX6 ARM Open Hardware Platform
The HIO Project, an open hardware project to enable developers and users to have access to an affordable Freescale i.MX6 ARM Cortex A9 Processor based open architecture platform.
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Lian Li Releases the PC-V358 M-ATX Chassis in North America
Flip Open Design Providing Easy Access to the Internal Components
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Lian Li Releases the PC-Q33 Mini-ITX Chassis in North America
Flip-Open Design and Space Efficient Hardware Support
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Cicoil Introduces High Flex, High Temperature Coaxial Cables
Cicoil's flexible 30 AWG Flat Coaxial Cable is available in 50 Ohm and 75 Ohm versions with 1 to 8 coax conductors, and is excellent for high performance video transmission in mil/aero, space, medical and commercial applications.
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WIN Announces Versatile Fanless Networking Desktop Platform
The unit features the Intel(r) Atom D2550 processor and a choice of either 4 or 6 GbE LAN with bypass function. The Intel(r) Atom(tm) processor provides solid performance at 1.86 GHz with low power consumption at 10W.
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VadaTech Announces MicroTCA Overview Guide
MicroTCA Overview Guide that provides a detailed explanation of the technology, along with product examples.
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MSC - Intelligent starter kit for high-end COM Express modules
The starter kit contains a COM Express Type 6 baseboard, a heat sink with fan and two 4GB DDR3L SO-DIMM memory modules. Designers are free to choose any COM Express module from MSC Technologies' MSC C6B-8S product family.
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Crocus Technology and TowerJazz qualify CTSX magnetic sensors; volume manufacturing launched
Selected customers will be able to sample Crocus' family of CTSX magnetic sensors that enable high-performance low-cost solutions for multiple consumer and industrial applications
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Storm Interface 5100 Series Now Available at Newark element14
New line of devices offers toughened, weather resistant data display with integral USB 2.0 interface
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New Power-to-Board Connector from Amphenol Provides High Current Single-Point of Connection
Sidney, N.Y. February 2014 - Amphenol Industrial Products Group, a global leader in interconnect systems, has expanded its line of RADSOK high current connectors with a new power-to-board connector. PowerBlok WTB (wire-to-board), a simple and cost effective latching connector, provides a high current single-point of connection to a PCB of up to 70 A.
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Axiomtek Announces SHB230, New 4th Generation Intel(r) Core(tm) PICMG 1.3 Half-Size Single Board Computer
The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane
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Amphenol's Data Link Connector among the Most Durable in its Class
Amphenol Industrial Products Group, a global leader in interconnect systems, offers one of the most durable data link connectors in its class; meeting SAE J2839 and IEC 61076-2-101 specifications. The Max-M12 withstands connector to cable retention forces of 444 N and contact retention forces of 110 N, tested at 100 mating cycles minimum.
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New Thermal Controller with User Friendly PC Software
Oven Industries features a Temperature Controller with easy-to-use software.
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3D Systems Brings 3DPRINTING 2.0 to Inside 3D Printing NYC Conference
Showcases most advanced manufacturing 3D printers and materials; Features full-color, multi-materials, metal, ceramic and edible 3D printing
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Econais Launches the World's Smallest, Smartest and Most Integrated Wi-Fi (SiP) Module.
The EC19W01 incorporates the latest Wi-Fi 802.11b/g/n standards and features to give designers a full array of options for embedding the module in their designs to get their devices on the internet and in the cloud as smartly as possible
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1,000W MicroTCA power supply
The PS-1142 supports shelves, cube, and other mechanical implementations and complies with the PICMG MicroTCA .4 Revision 1.0 specification.
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Renesas Electronics America and Express Logic Announce RZ Express Program to Drive Development of HMI Applications
Build Differentiated HMI Solutions on Top of the Renesas RZ/A MPU Hardware Platform with Express Logic ThreadX(r) RTOS and Middleware
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Eurocom announces pricing of Initial Public Offering
Eurocom today announced the pricing of its initial public offering of 400 000 shares of its common stock at a price to the public at $20 per share. The shares are expected to begin trading on the NASDAQ on April 1, 2014 under the symbol "EM". Closing of the offering is expected to occur on April 16, 2014, subject to customary closing conditions.
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Teledyne LeCroy Demonstrates Latest Test Technology for Embedded Systems Development at EE Live 2014
Teledyne LeCroy is a leading provider of oscilloscopes, protocol analyzers and related test and measurement solutions that enable companies across a wide range of industries to design and test electronic devices of all types.
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LAVA Unveils New Internet of Things Connectivity Solution
LAVA Computer MFG Inc. today unveiled the LAVA Internet Protocol System (www.lavaipsystem.com), a new Internet-of-Things (IoT) connectivity solution, delivering a powerful shortcut for IoT device developers. The LAVA IP System is the first solution to provide 12 simultaneous TCP or UDP connections for simple, low-cost electronic devices, significantly expanding possible IoT functions and capabilities.
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Saelig Unveils New Triple-Function IC - WOM/BLED/4:33
Write-only memory, black LED, and music chip all incorporated into one device - only available today.
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Microchip Introduces Cost-Effective 8-bit PIC(r) Microcontroller Family With Intelligent Analog and Core Independent Peripherals
PIC16F170X/171X MCUs Reduce Design Complexity and System BOM Cost With Integrated Op Amps, Zero Cross Detect and Peripheral Pin Select
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VadaTech Launches New User-Friendly Web Site
This allows users to search for common architectures like MicroTCA, VPX, and AdvancedTCA or by products such as FPGAs, processors, switches, and more.
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Supermicro(r) Exhibits Battery Backup Power for Mission Critical Embedded Applications at EE Live ESC 2014
Enterprise-Class Embedded Building Block Solutions Cover Wide Range of Applications from Compact Appliances to Power Saving, High Performance Server Solutions
Freescale Semiconductor
Cermetek Microelectronics
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