Dynamic Overprovisioning and Mid-Density Options Offer Greater Flexibility and Cost-Saving
Taipei, Taiwan (March, 2017) - ATP Electronics Inc., reveals its new 3D NAND based SATA product line up on the Embedded World 2017 in Nuremberg. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP's in-house self-packaging technology. Available form factors include 2.5", mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192GB, 384GB and 768GB. The products will be showcased at ATP's booth in Hall 1, Booth #1-655.